A platform for research: civil engineering, architecture and urbanism
Zero-Level Packaging for MEMS or MST Devices: The IRS Method
Zero-Level Packaging for MEMS or MST Devices: The IRS Method
Zero-Level Packaging for MEMS or MST Devices: The IRS Method
Tilmans, H. (author) / Van de Peer, M. (author) / Beyne, E. (author)
ADVANCING MICROELECTRONICS ; 27 ; 37-39
2000-01-01
3 pages
Article (Journal)
English
DDC:
621.381
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2002
|Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
British Library Online Contents | 2004
|Packaging Options for MEMS Devices
British Library Online Contents | 2003
|Wafer Level Hermetic Packaging for RF-MEMS Devices Using Electroplated Gold Layers
British Library Online Contents | 2006
|Low-Cost Wafer-Level Vacuum Packaging for MEMS
British Library Online Contents | 2003
|