Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low-Cost Wafer-Level Vacuum Packaging for MEMS
Low-Cost Wafer-Level Vacuum Packaging for MEMS
Low-Cost Wafer-Level Vacuum Packaging for MEMS
Gooch, R. (Autor:in) / Schimert, T. (Autor:in)
MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 28 ; 55-60
01.01.2003
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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