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Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

Liu, Y.-H. / Chuang, C.-M. / Lin, K.-L.

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Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

Liu, Y.-H. / Chuang, C.-M. / Lin, K.-L.

Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

Liu, Y.-H. / Chuang, C.-M. / Lin, K.-L.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

Contributors:

Liu, Y.-H. (author) / Chuang, C.-M. (author) / Lin, K.-L. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 2471-2477

Publication date:

2004-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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