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Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test
Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test
Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test
Liu, Y.-H. (author) / Chuang, C.-M. (author) / Lin, K.-L. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 2471-2477
2004-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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