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    Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

    New search for: Liu, Y.-H.
    New search for: Chuang, C.-M.
    New search for: Lin, K.-L.

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    Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

    New search for: Liu, Y.-H.
    New search for: Chuang, C.-M.
    New search for: Lin, K.-L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

    New search for: Liu, Y.-H.
    New search for: Chuang, C.-M.
    New search for: Lin, K.-L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

    Contributors:

    Liu, Y.-H. (author) / Chuang, C.-M. (author) / Lin, K.-L. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 2471-2477

    Publication date:

    2004-01-01

    Size:

    7 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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