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    TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

    New search for: Liu, Baolei
    New search for: Tian, Yanhong
    New search for: Liu, Wei
    New search for: Wu, Weiwei
    New search for: Wang, Chunqing

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    TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

    New search for: Liu, Baolei
    New search for: Tian, Yanhong
    New search for: Liu, Wei
    New search for: Wu, Weiwei
    New search for: Wang, Chunqing

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

    New search for: Liu, Baolei
    New search for: Tian, Yanhong
    New search for: Liu, Wei
    New search for: Wu, Weiwei
    New search for: Wang, Chunqing

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

    Contributors:

    Liu, Baolei (author) / Tian, Yanhong (author) / Liu, Wei (author) / Wu, Weiwei (author) / Wang, Chunqing (author)

    Published in:

    MATERIALS LETTERS ; 163 ; 254-257

    Publication date:

    2016-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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