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    Reaction between Sn-In Solder and Under Bump Metallurgy

    New search for: Choi, J. H.
    New search for: Jung, B. Y.
    New search for: Jun, S. W.
    New search for: Kim, Y. H.
    New search for: Oh, T. S.
    New search for: Kang, S.-G.
    New search for: Kobayashi, T.

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    Reaction between Sn-In Solder and Under Bump Metallurgy

    New search for: Choi, J. H.
    New search for: Jung, B. Y.
    New search for: Jun, S. W.
    New search for: Kim, Y. H.
    New search for: Oh, T. S.
    New search for: Kang, S.-G.
    New search for: Kobayashi, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reaction between Sn-In Solder and Under Bump Metallurgy

    New search for: Choi, J. H.
    New search for: Jung, B. Y.
    New search for: Jun, S. W.
    New search for: Kim, Y. H.
    New search for: Oh, T. S.
    New search for: Kang, S.-G.
    New search for: Kobayashi, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Reaction between Sn-In Solder and Under Bump Metallurgy

    Contributors:

    Choi, J. H. (author) / Jung, B. Y. (author) / Jun, S. W. (author) / Kim, Y. H. (author) / Oh, T. S. (author) / Kang, S.-G. / Kobayashi, T.

    Published in:

    Designing, Processing and Properties of Advanced Engineering Materials PART 1 ; 401-404

    MATERIALS SCIENCE FORUM ; 449/452

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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