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    Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects

    New search for: Hobbs, A.
    New search for: Murakami, S.
    New search for: Hosoda, T.
    New search for: Ohtsuka, S.
    New search for: Miyajima, M.
    New search for: Sugatani, S.
    New search for: Nakamura, T.

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    Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects

    New search for: Hobbs, A.
    New search for: Murakami, S.
    New search for: Hosoda, T.
    New search for: Ohtsuka, S.
    New search for: Miyajima, M.
    New search for: Sugatani, S.
    New search for: Nakamura, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects

    New search for: Hobbs, A.
    New search for: Murakami, S.
    New search for: Hosoda, T.
    New search for: Ohtsuka, S.
    New search for: Miyajima, M.
    New search for: Sugatani, S.
    New search for: Nakamura, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects

    Contributors:

    Hobbs, A. (author) / Murakami, S. (author) / Hosoda, T. (author) / Ohtsuka, S. (author) / Miyajima, M. (author) / Sugatani, S. (author) / Nakamura, T. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 43 ; 1629-1632

    Publication date:

    2002-01-01

    Size:

    4 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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