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Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu, Y. C. / Lin, Y. H. / Kao, C. R. / Tu, K. N.

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Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu, Y. C. / Lin, Y. H. / Kao, C. R. / Tu, K. N.

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu, Y. C. / Lin, Y. H. / Kao, C. R. / Tu, K. N.

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Check availability in my library

Order at Subito €

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Title:

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Contributors:

Hu, Y. C. (author) / Lin, Y. H. (author) / Kao, C. R. (author) / Tu, K. N. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 18 ; 2544-2548

Publication date:

2003-01-01

Size:

5 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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