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    Rotational grinding of silicon wafers-sub-surface damage inspection

    New search for: Haapalinna, A.
    New search for: Nevas, S.
    New search for: Pahler, D.

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    Rotational grinding of silicon wafers-sub-surface damage inspection

    New search for: Haapalinna, A.
    New search for: Nevas, S.
    New search for: Pahler, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Rotational grinding of silicon wafers-sub-surface damage inspection

    New search for: Haapalinna, A.
    New search for: Nevas, S.
    New search for: Pahler, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Rotational grinding of silicon wafers-sub-surface damage inspection

    Contributors:

    Haapalinna, A. (author) / Nevas, S. (author) / Pahler, D. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 107 ; 321-331

    Publication date:

    2004-01-01

    Size:

    11 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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