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    Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

    New search for: Kariya, Y.
    New search for: Hosoi, T.
    New search for: Kimura, T.
    New search for: Terashima, S.
    New search for: Tanaka, M.

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    Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

    New search for: Kariya, Y.
    New search for: Hosoi, T.
    New search for: Kimura, T.
    New search for: Terashima, S.
    New search for: Tanaka, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

    New search for: Kariya, Y.
    New search for: Hosoi, T.
    New search for: Kimura, T.
    New search for: Terashima, S.
    New search for: Tanaka, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

    Contributors:

    Kariya, Y. (author) / Hosoi, T. (author) / Kimura, T. (author) / Terashima, S. (author) / Tanaka, M. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 45 ; 689-694

    Publication date:

    2004-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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