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    Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

    New search for: Kim, S. T.
    New search for: Huh, J. Y.

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    Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

    New search for: Kim, S. T.
    New search for: Huh, J. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

    New search for: Kim, S. T.
    New search for: Huh, J. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

    Contributors:

    Kim, S. T. (author) / Huh, J. Y. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 475/479 ; 2627-2630

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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