Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Application of "Ideal" Insulated Metal Substrates in Ball Grid Array (BGA) Packages

    New search for: Jiman, Z.
    New search for: Liquan, G.
    New search for: Jusheng, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Application of "Ideal" Insulated Metal Substrates in Ball Grid Array (BGA) Packages

    New search for: Jiman, Z.
    New search for: Liquan, G.
    New search for: Jusheng, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Application of "Ideal" Insulated Metal Substrates in Ball Grid Array (BGA) Packages

    New search for: Jiman, Z.
    New search for: Liquan, G.
    New search for: Jusheng, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Application of "Ideal" Insulated Metal Substrates in Ball Grid Array (BGA) Packages

    Contributors:

    Jiman, Z. (author) / Liquan, G. (author) / Jusheng, M. (author)

    Published in:

    RARE METAL MATERIALS AND ENGINEERING ; 33 ; 432-435

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    1002-185X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermal fatigue life prediction of solder joints of plastic ball grid array packages

    Chu, Yin Fun / Yi, Sung / Geng, Phil | British Library Online Contents | 2014

    Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages

    Jen, Y. M. / Chien, H. H. / Lin, T. S. et al. | British Library Online Contents | 2006

    Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 ^oC

    Shih, P.-C. / Lin, K.-L. | British Library Online Contents | 2007

    AlN Substrates and Packages

    British Library Online Contents | 1994

    Bonding Characteristics of Underfilled Ball Grid Array Packaging

    Yim, Byung-Seung / Lee, Jeong Il / Lee, Byung Hun et al. | British Library Online Contents | 2015

    Back to top