Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 ^oC: Fid-Bau Portal

Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 ^oC

Shih, P.-C. / Lin, K.-L.

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Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 ^oC

Shih, P.-C. / Lin, K.-L.

Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 ^oC

Shih, P.-C. / Lin, K.-L.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 ^oC

Contributors:

Shih, P.-C. (author) / Lin, K.-L. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 113-123

Publication date:

2007-01-01

Size:

11 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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