A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
Park, Donghyun (author) / Han, Kee-Sun (author) / Oh, Tae Sung (author)
Materials transactions ; 58 ; 1217-1222
2017-01-01
6 pages
Article (Journal)
English
DDC:
620.1105
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