Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer: Fid-Bau Portal

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Tian, Y. B. / Kang, R. K. / Guo, D. M. / Jin, Z. J. / Su, J. X.

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Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Tian, Y. B. / Kang, R. K. / Guo, D. M. / Jin, Z. J. / Su, J. X.

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Tian, Y. B. / Kang, R. K. / Guo, D. M. / Jin, Z. J. / Su, J. X.

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Check availability in my library

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Document information

Title:

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Contributors:

Tian, Y. B. (author) / Kang, R. K. (author) / Guo, D. M. (author) / Jin, Z. J. (author) / Su, J. X. (author) / Ai, X. / Li, J. / Huang, C.

Published in:

Advances in Materials Manufacturing Science and Technology ; 362-368

MATERIALS SCIENCE FORUM ; 471/472

Publication date:

2004-01-01

Size:

7 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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