Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer: Fid-Bau Portal

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Sasaki, J. / Tsuruga, T. / Soltani, B.H. / Mitsuta, T. / Tian, Y.B. / Shimizu, J. / Zhou, L.B. / Eda, H. / Tashiro, Y. / Iwase, H.

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Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Sasaki, J. / Tsuruga, T. / Soltani, B.H. / Mitsuta, T. / Tian, Y.B. / Shimizu, J. / Zhou, L.B. / Eda, H. / Tashiro, Y. / Iwase, H.

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Sasaki, J. / Tsuruga, T. / Soltani, B.H. / Mitsuta, T. / Tian, Y.B. / Shimizu, J. / Zhou, L.B. / Eda, H. / Tashiro, Y. / Iwase, H.

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Document information

Title:

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Contributors:

Sasaki, J. (author) / Tsuruga, T. (author) / Soltani, B.H. (author) / Mitsuta, T. (author) / Tian, Y.B. (author) / Shimizu, J. (author) / Zhou, L.B. (author) / Eda, H. (author) / Tashiro, Y. (author) / Iwase, H. (author)

Published in:

KEY ENGINEERING MATERIALS ; 389/390 ; 13-17

Publication date:

2009-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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