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Void evolution and its dependence on segment length in Cu interconnects

Leon, R. / Colon, J. A. / Evans, K. C. / Vu, D. T. / Blaschke, V. / Bavarian, B. / Ogawa, E. T. / Ho, P. S.

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Void evolution and its dependence on segment length in Cu interconnects

Leon, R. / Colon, J. A. / Evans, K. C. / Vu, D. T. / Blaschke, V. / Bavarian, B. / Ogawa, E. T. / Ho, P. S.

Void evolution and its dependence on segment length in Cu interconnects

Leon, R. / Colon, J. A. / Evans, K. C. / Vu, D. T. / Blaschke, V. / Bavarian, B. / Ogawa, E. T. / Ho, P. S.

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Check availability in my library

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Document information

Title:

Void evolution and its dependence on segment length in Cu interconnects

Contributors:

Leon, R. (author) / Colon, J. A. (author) / Evans, K. C. (author) / Vu, D. T. (author) / Blaschke, V. (author) / Bavarian, B. (author) / Ogawa, E. T. (author) / Ho, P. S. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 3135-3138

Publication date:

2004-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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