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    Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

    New search for: Chen, H.
    New search for: Mueller, M.
    New search for: Mattila, T.T.
    New search for: Li, J.
    New search for: Liu, X.
    New search for: Wolter, K.-J.
    New search for: Paulasto-Krockel, M.

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    Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

    New search for: Chen, H.
    New search for: Mueller, M.
    New search for: Mattila, T.T.
    New search for: Li, J.
    New search for: Liu, X.
    New search for: Wolter, K.-J.
    New search for: Paulasto-Krockel, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

    New search for: Chen, H.
    New search for: Mueller, M.
    New search for: Mattila, T.T.
    New search for: Li, J.
    New search for: Liu, X.
    New search for: Wolter, K.-J.
    New search for: Paulasto-Krockel, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

    Contributors:

    Chen, H. (author) / Mueller, M. (author) / Mattila, T.T. (author) / Li, J. (author) / Liu, X. (author) / Wolter, K.-J. (author) / Paulasto-Krockel, M. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 2103-2116

    Publication date:

    2011-01-01

    Size:

    14 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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