Intermetallic compounds at the interface between Sn-Cu(-Ni) solders and Cu substrate: Fid-Bau Portal

Intermetallic compounds at the interface between Sn-Cu(-Ni) solders and Cu substrate

Harcuba, P. / Janecek, M. / Slamova, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Intermetallic compounds at the interface between Sn-Cu(-Ni) solders and Cu substrate

Harcuba, P. / Janecek, M. / Slamova, M.

Intermetallic compounds at the interface between Sn-Cu(-Ni) solders and Cu substrate

Harcuba, P. / Janecek, M. / Slamova, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Intermetallic compounds at the interface between Sn-Cu(-Ni) solders and Cu substrate

Contributors:

Harcuba, P. (author) / Janecek, M. (author) / Slamova, M. (author)

Published in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 100 ; 814-817

Publication date:

2009-01-01

Size:

4 pages

ISSN:

1862-5282

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669.9

Kim, S. T. / Huh, J. Y. | British Library Online Contents | 2005

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chen, W. / Xue, S. / Wang, H. et al. | British Library Online Contents | 2009

Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders

Lee, J. W. / Lee, Z. H. / Lee, H. M. | British Library Online Contents | 2005

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, Y. C. / Yu, J. / Kang, S. K. et al. | British Library Online Contents | 2004

Investigation of Intermetallic Phases Formed in Lead-Free Solders

Nagy, E. / Gyenes, A. / Molnar, A. et al. | British Library Online Contents | 2015