Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    New search for: Kim, D.-G.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    New search for: Kim, D.-G.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    New search for: Kim, D.-G.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    Contributors:

    Kim, D.-G. (author) / Jung, S.-B. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 46 ; 1295-1300

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

    Gao, F. / Cheng, F. / Nishikawa, H. et al. | British Library Online Contents | 2008

    Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

    Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri et al. | British Library Online Contents | 2016

    Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

    Kim, D. G. / Jang, H. S. / Kim, Y. J. et al. | British Library Online Contents | 2005

    Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

    Yahaya, M. Z. / Ani, F. C. / Samsudin, Z. et al. | British Library Online Contents | 2016

    Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

    Wang, M. / Wang, J. / Feng, H. et al. | British Library Online Contents | 2012

    Back to top