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    Surface activated bonding of LCP/Cu for electronic packaging

    New search for: Howlader, M. M.
    New search for: Suga, T.
    New search for: Takahashi, A.
    New search for: Saijo, K.
    New search for: Ozawa, S.
    New search for: Nanbu, K.

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    Surface activated bonding of LCP/Cu for electronic packaging

    New search for: Howlader, M. M.
    New search for: Suga, T.
    New search for: Takahashi, A.
    New search for: Saijo, K.
    New search for: Ozawa, S.
    New search for: Nanbu, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Surface activated bonding of LCP/Cu for electronic packaging

    New search for: Howlader, M. M.
    New search for: Suga, T.
    New search for: Takahashi, A.
    New search for: Saijo, K.
    New search for: Ozawa, S.
    New search for: Nanbu, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Surface activated bonding of LCP/Cu for electronic packaging

    Contributors:

    Howlader, M. M. (author) / Suga, T. (author) / Takahashi, A. (author) / Saijo, K. (author) / Ozawa, S. (author) / Nanbu, K. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 40 ; 3177-3184

    Publication date:

    2005-01-01

    Size:

    8 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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