Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint: Fid-Bau Portal

Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint

Choi, J.-H. / Lee, K.-Y. / Jun, S.-W. / Kim, Y.-H. / Oh, T.-S.

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Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint

Choi, J.-H. / Lee, K.-Y. / Jun, S.-W. / Kim, Y.-H. / Oh, T.-S.

Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint

Choi, J.-H. / Lee, K.-Y. / Jun, S.-W. / Kim, Y.-H. / Oh, T.-S.

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Check availability in my library

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Document information

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Document information

Title:

Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint

Contributors:

Choi, J.-H. (author) / Lee, K.-Y. (author) / Jun, S.-W. (author) / Kim, Y.-H. (author) / Oh, T.-S. (author)

Published in:

MATERIALS TRANSACTIONS ; 46 ; 1042-1046

Publication date:

2005-01-01

Size:

5 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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