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    Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au-Ni ball grid array (BGA) substrate after multiple reflows

    New search for: Koo, J.-M.
    New search for: Yoon, J.-W.
    New search for: Jung, S.-B.

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    Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au-Ni ball grid array (BGA) substrate after multiple reflows

    New search for: Koo, J.-M.
    New search for: Yoon, J.-W.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au-Ni ball grid array (BGA) substrate after multiple reflows

    New search for: Koo, J.-M.
    New search for: Yoon, J.-W.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au-Ni ball grid array (BGA) substrate after multiple reflows

    Contributors:

    Koo, J.-M. (author) / Yoon, J.-W. (author) / Jung, S.-B. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1631-1641

    Publication date:

    2008-01-01

    Size:

    11 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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