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Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates
Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates
Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates
Susan, D. F. (author) / Rejent, J. A. (author) / Hlava, P. F. (author) / Vianco, P. T. (author)
JOURNAL OF MATERIALS SCIENCE ; 44 ; 545-555
2009-01-01
11 pages
Article (Journal)
English
DDC:
620.11
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