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    Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

    New search for: Shohji, I.
    New search for: Goto, H.
    New search for: Nakamura, K.
    New search for: Ookubo, T.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

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    Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

    New search for: Shohji, I.
    New search for: Goto, H.
    New search for: Nakamura, K.
    New search for: Ookubo, T.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

    New search for: Shohji, I.
    New search for: Goto, H.
    New search for: Nakamura, K.
    New search for: Ookubo, T.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

    Contributors:

    Shohji, I. (author) / Goto, H. (author) / Nakamura, K. (author) / Ookubo, T. (author) / Kim, Y.-J. / Bae, D.-H.

    Published in:

    Advances in Fracture and Strength ; 2864-2869

    KEY ENGINEERING MATERIALS ; 297/300

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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