Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

    New search for: Kim, D. G.
    New search for: Kim, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

    New search for: Kim, D. G.
    New search for: Kim, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

    New search for: Kim, D. G.
    New search for: Kim, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

    Contributors:

    Kim, D. G. (author) / Kim, J. W. (author) / Jung, S. B. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 121 ; 204-210

    Publication date:

    2005-01-01

    Size:

    7 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

    Tseng, C. F. / Duh, J. G. | British Library Online Contents | 2013

    Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

    Chen, W. Y. / Yu, C. Y. / Duh, J. G. | British Library Online Contents | 2012

    Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

    Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri et al. | British Library Online Contents | 2016

    Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

    Yahaya, M. Z. / Ani, F. C. / Samsudin, Z. et al. | British Library Online Contents | 2016

    Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

    Cheng, F.J. / Nishikawa, H. / Takemoto, T. | British Library Online Contents | 2008

    Back to top