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Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM
Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM
Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM
Kim, D. G. (author) / Kim, J. W. (author) / Jung, S. B. (author)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 121 ; 204-210
2005-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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