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    Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

    New search for: Sohn, Y.-C.
    New search for: Yu, J.

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    Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

    New search for: Sohn, Y.-C.
    New search for: Yu, J.

    Access

    Access via TIB
    Check availability in my library
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    Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

    New search for: Sohn, Y.-C.
    New search for: Yu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

    Contributors:

    Sohn, Y.-C. (author) / Yu, J. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 1931-1934

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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