Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging: Fid-Bau Portal

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Wang, I. T. / Duh, J. G. / Cheng, C. Y. / Wang, J.

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Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Wang, I. T. / Duh, J. G. / Cheng, C. Y. / Wang, J.

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Wang, I. T. / Duh, J. G. / Cheng, C. Y. / Wang, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Title:

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Contributors:

Wang, I. T. (author) / Duh, J. G. (author) / Cheng, C. Y. (author) / Wang, J. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING B ADVANCED FUNCTIONAL SOLID STATE MATERIALS ; 177 ; 278-282

Publication date:

2012-01-01

Size:

5 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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