Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Huang, Z. / Conway, P. P. / Liu, C. et al. | British Library Online Contents | 2005

Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating

Nakamura, K. / Shohji, I. / Goto, H. et al. | British Library Online Contents | 2005

Formation of intermetallic compounds with Sn-Zn-Al solder on copper and electroless nickel-immersion gold substrates

Snugovsky, L. / Snugovsky, P. / Perovic, D. D. et al. | British Library Online Contents | 2007

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Wang, I. T. / Duh, J. G. / Cheng, C. Y. et al. | British Library Online Contents | 2012

Standards Development Efforts for Electroless Nickel Immersion Gold: IPC-4552

Milad, G. / O brien, G. / IPC | British Library Conference Proceedings | 2001