Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface: Fid-Bau Portal

Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface

Yu, D. Q. / Wu, C. M. L. / He, D. P. / Zhao, N. / Wang, L. / Lai, J. K. L.

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Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface

Yu, D. Q. / Wu, C. M. L. / He, D. P. / Zhao, N. / Wang, L. / Lai, J. K. L.

Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface

Yu, D. Q. / Wu, C. M. L. / He, D. P. / Zhao, N. / Wang, L. / Lai, J. K. L.

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Check availability in my library

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Document information

Title:

Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface

Contributors:

Yu, D. Q. (author) / Wu, C. M. L. (author) / He, D. P. (author) / Zhao, N. (author) / Wang, L. (author) / Lai, J. K. L. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2205-2212

Publication date:

2005-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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