Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test: Fid-Bau Portal

Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

Lee, H. Y. / Park, Y. B. / Jeon, I. / Kim, Y. H. / Chang, Y. K.

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Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

Lee, H. Y. / Park, Y. B. / Jeon, I. / Kim, Y. H. / Chang, Y. K.

Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

Lee, H. Y. / Park, Y. B. / Jeon, I. / Kim, Y. H. / Chang, Y. K.

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Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Titel:

Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

Beteiligte:

Lee, H. Y. (Autor:in) / Park, Y. B. (Autor:in) / Jeon, I. (Autor:in) / Kim, Y. H. (Autor:in) / Chang, Y. K. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING A ; 405 ; 50-64

Erscheinungsdatum:

01.01.2005

Format / Umfang:

15 pages

ISSN:

0921-5093

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Lee, H. Y. / Park, G. S. | British Library Online Contents | 2002

Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

Lee, H. Y. / Chang, Y. K. | British Library Online Contents | 2004

Failure paths of the Cu-based leadframe/EMC joints

Lee, H. Y. | British Library Online Contents | 2001

Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

Kurtz, O. / Wunderlich, C. / Ruther, R. et al. | British Library Online Contents | 2008

Plated leadframe metrology

Reilly, F. C. | British Library Online Contents | 2002

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