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    Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

    New search for: Kuhmann, J. F.
    New search for: Chiang, C.-H.
    New search for: Harde, P.
    New search for: Reier, F.
    New search for: Oesterle, W.
    New search for: Urban, I.
    New search for: Klein, A.

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    Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

    New search for: Kuhmann, J. F.
    New search for: Chiang, C.-H.
    New search for: Harde, P.
    New search for: Reier, F.
    New search for: Oesterle, W.
    New search for: Urban, I.
    New search for: Klein, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

    New search for: Kuhmann, J. F.
    New search for: Chiang, C.-H.
    New search for: Harde, P.
    New search for: Reier, F.
    New search for: Oesterle, W.
    New search for: Urban, I.
    New search for: Klein, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

    Contributors:

    Kuhmann, J. F. (author) / Chiang, C.-H. (author) / Harde, P. (author) / Reier, F. (author) / Oesterle, W. (author) / Urban, I. (author) / Klein, A. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 242 ; 22-25

    Publication date:

    1998-01-01

    Size:

    4 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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