Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization: Fid-Bau Portal

Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Huang, C. P. / Chen, C. / Liu, C. Y. / Lin, S. S. / Chen, K. H.

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Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Huang, C. P. / Chen, C. / Liu, C. Y. / Lin, S. S. / Chen, K. H.

Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Huang, C. P. / Chen, C. / Liu, C. Y. / Lin, S. S. / Chen, K. H.

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Access via TIB

Check availability in my library

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Title:

Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Contributors:

Huang, C. P. (author) / Chen, C. (author) / Liu, C. Y. (author) / Lin, S. S. (author) / Chen, K. H. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2772-2779

Publication date:

2005-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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