Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization: Fid-Bau Portal

Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Huang, C. P. / Chen, C. / Liu, C. Y. / Lin, S. S. / Chen, K. H.

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Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Huang, C. P. / Chen, C. / Liu, C. Y. / Lin, S. S. / Chen, K. H.

Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Huang, C. P. / Chen, C. / Liu, C. Y. / Lin, S. S. / Chen, K. H.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Beteiligte:

Huang, C. P. (Autor:in) / Chen, C. (Autor:in) / Liu, C. Y. (Autor:in) / Lin, S. S. (Autor:in) / Chen, K. H. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2772-2779

Erscheinungsdatum:

01.01.2005

Format / Umfang:

8 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Kang, K.I. / Jung, J.P. / Bang, W.H. et al. | British Library Online Contents | 2008

Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

Jang, D.M. / Yu, J. | British Library Online Contents | 2011

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Zhang, F. / Li, M. / Chum, C. C. et al. | British Library Online Contents | 2002

Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization

Wu, A. T. / Hua, F. | British Library Online Contents | 2007

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