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    Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

    New search for: Ding, Y.
    New search for: Kim, J. K.
    New search for: Tong, P.

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    Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

    New search for: Ding, Y.
    New search for: Kim, J. K.
    New search for: Tong, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

    New search for: Ding, Y.
    New search for: Kim, J. K.
    New search for: Tong, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

    Contributors:

    Ding, Y. (author) / Kim, J. K. (author) / Tong, P. (author)

    Published in:

    MECHANICS OF MATERIALS ; 38 ; 11-24

    Publication date:

    2006-01-01

    Size:

    14 pages

    ISSN:

    0167-6636

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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