A platform for research: civil engineering, architecture and urbanism
Interface reactions between 50In-50Pb solder and electroplated Au layers
Interface reactions between 50In-50Pb solder and electroplated Au layers
Interface reactions between 50In-50Pb solder and electroplated Au layers
Vianco, P. (author) / Bryant, G. (author) / Hlava, P. (author) / Zender, G. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 409 ; 179-194
2005-01-01
16 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Process integration of electroplated solder bumps for WLP
British Library Online Contents | 2001
|British Library Online Contents | 2005
|Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
British Library Online Contents | 2015
|British Library Online Contents | 2005
|Fluxless Sn-Ag bonding in vacuum using electroplated layers
British Library Online Contents | 2007
|