Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM: Fid-Bau Portal

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

Kim, D. G. / Jang, H. S. / Kim, J. W. / Jung, S. B.

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Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

Kim, D. G. / Jang, H. S. / Kim, J. W. / Jung, S. B.

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

Kim, D. G. / Jang, H. S. / Kim, J. W. / Jung, S. B.

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Check availability in my library

Order at Subito €

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Document information

Title:

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

Contributors:

Kim, D. G. (author) / Jang, H. S. (author) / Kim, J. W. (author) / Jung, S. B. (author) / Kim, Y.-J. / Bae, D.-H.

Published in:

Advances in Fracture and Strength ; 863-868

KEY ENGINEERING MATERIALS ; 297/300

Publication date:

2005-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Kim, D. G. / Ha, S. S. / Jung, S. B. | British Library Online Contents | 2006

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