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    Current State and Trend in Study of Electrochemically Deposited Copper for Interconnects of Ultra - Large - Scale Integrate Circuits

    New search for: Zhang, W.
    New search for: Cheng, D.-h.
    New search for: Wang, J.-y.
    New search for: Yu, Z.-z.

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    Current State and Trend in Study of Electrochemically Deposited Copper for Interconnects of Ultra - Large - Scale Integrate Circuits

    New search for: Zhang, W.
    New search for: Cheng, D.-h.
    New search for: Wang, J.-y.
    New search for: Yu, Z.-z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Current State and Trend in Study of Electrochemically Deposited Copper for Interconnects of Ultra - Large - Scale Integrate Circuits

    New search for: Zhang, W.
    New search for: Cheng, D.-h.
    New search for: Wang, J.-y.
    New search for: Yu, Z.-z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Current State and Trend in Study of Electrochemically Deposited Copper for Interconnects of Ultra - Large - Scale Integrate Circuits

    Contributors:

    Zhang, W. (author) / Cheng, D.-h. (author) / Wang, J.-y. (author) / Yu, Z.-z. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 38 ; 33 - 38

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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