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Microstructure formation in electrochemically deposited Copper thin films
Microstructure formation in electrochemically deposited Copper thin films
Microstructure formation in electrochemically deposited Copper thin films
Kremmer, K. (author) / Yezerska, O. (author) / Schreiber, G. (author) / Masimov, M. (author) / Klemm, V. (author) / Schneider, M. (author) / Rafaja, D. (author)
MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK ; 38 ; 121-124
2007-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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