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Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag~2O for Packaging of High-Temperature Electronics
Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag~2O for Packaging of High-Temperature Electronics
Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag~2O for Packaging of High-Temperature Electronics
Hirose, A. (author) / Takeda, N. (author) / Konaka, Y. (author) / Tatsumi, H. (author) / Akada, Y. (author) / Ogura, T. (author) / Ide, E. (author) / Morita, T. (author) / Chandra, T. / Ionescu, M.
2012-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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