Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging
Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging
Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging
Zhang, X. P. (Autor:in) / Lim, C. S. H. (Autor:in) / Mai, Y. W. (Autor:in) / Shi, Y. W. (Autor:in) / Liu, H.-Y. / Hu, X. / Hoffman, M.
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
| British Library Online Contents | 2017
In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints
| British Library Online Contents | 2011
Experimental damage mechanics of microelectronic solder joints under fatigue loading
| British Library Online Contents | 2004
Fatigue crack propagation behavior of underfill materials in microelectronic packaging
| British Library Online Contents | 2001
Future packaging: Market forecasts for microelectronic packaging
British Library Online Contents | 2009