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Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

Huang, H. / Winchester, K. J. / Suvorova, A. / Lawn, B. R. / Liu, Y. / Hu, X. Z. / Dell, J. M. / Faraone, L.

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Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

Huang, H. / Winchester, K. J. / Suvorova, A. / Lawn, B. R. / Liu, Y. / Hu, X. Z. / Dell, J. M. / Faraone, L.

Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

Huang, H. / Winchester, K. J. / Suvorova, A. / Lawn, B. R. / Liu, Y. / Hu, X. Z. / Dell, J. M. / Faraone, L.

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Check availability in my library

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Document information

Title:

Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

Contributors:

Huang, H. (author) / Winchester, K. J. (author) / Suvorova, A. (author) / Lawn, B. R. (author) / Liu, Y. (author) / Hu, X. Z. (author) / Dell, J. M. (author) / Faraone, L. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 435/436 ; 453-459

Publication date:

2006-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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