Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding

    New search for: Li, M.
    New search for: Ji, H.
    New search for: Wang, C.
    New search for: Kung, A. T.
    New search for: Bang, H. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding

    New search for: Li, M.
    New search for: Ji, H.
    New search for: Wang, C.
    New search for: Kung, A. T.
    New search for: Bang, H. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding

    New search for: Li, M.
    New search for: Ji, H.
    New search for: Wang, C.
    New search for: Kung, A. T.
    New search for: Bang, H. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding

    Contributors:

    Li, M. (author) / Ji, H. (author) / Wang, C. (author) / Kung, A. T. (author) / Bang, H. S. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 22 ; 483-486

    Publication date:

    2006-01-01

    Size:

    4 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Bonding characteristics of heat resistant high-bond enameled wire

    Toyama, Y. / Takahashi, K. | Engineering Index Backfile | 1963

    Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method

    Bang, H.S. / Ji, H.J. / Li, M.Y. et al. | British Library Online Contents | 2008

    Wire Bond Technology - The Great Debate: Ball vs. Wedge

    Beck, D. J. / Perez, A. C. | British Library Online Contents | 2007

    Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

    Ji, H. / Li, M. / Wang, C. et al. | British Library Online Contents | 2007

    PART FOR WEDGE BONDING

    SHIGEYOSHI HIDEKAZU | European Patent Office | 2017

    Free access
    Back to top