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High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications

Singh, R. / Radu, I. / Reiche, M. / Himcinschi, C. / Kuck, B. / Tillack, B. / Gosele, U. / Christiansen, S. H.

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High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications

Singh, R. / Radu, I. / Reiche, M. / Himcinschi, C. / Kuck, B. / Tillack, B. / Gosele, U. / Christiansen, S. H.

High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications

Singh, R. / Radu, I. / Reiche, M. / Himcinschi, C. / Kuck, B. / Tillack, B. / Gosele, U. / Christiansen, S. H.

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Document information

Title:

High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications

Contributors:

Singh, R. (author) / Radu, I. (author) / Reiche, M. (author) / Himcinschi, C. (author) / Kuck, B. (author) / Tillack, B. (author) / Gosele, U. (author) / Christiansen, S. H. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 3595-3599

Publication date:

2007-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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