Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding: Fid-Bau Portal

Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding

Wang, Q. / Choa, S. H. / Kim, W. B. / Hwang, J. S. / Ham, S. J. / Moon, C. Y.

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Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding

Wang, Q. / Choa, S. H. / Kim, W. B. / Hwang, J. S. / Ham, S. J. / Moon, C. Y.

Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding

Wang, Q. / Choa, S. H. / Kim, W. B. / Hwang, J. S. / Ham, S. J. / Moon, C. Y.

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Check availability in my library

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Title:

Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding

Contributors:

Wang, Q. (author) / Choa, S. H. (author) / Kim, W. B. (author) / Hwang, J. S. (author) / Ham, S. J. (author) / Moon, C. Y. (author) / Lee, S.-B. / Kim, Y.-J.

Published in:

Experimental Mechanics in Nano and Biotechnology ; 609-612

KEY ENGINEERING MATERIALS ; 326/328

Publication date:

2006-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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