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    Wafer Level Hermetic Packaging for RF-MEMS Devices Using Electroplated Gold Layers

    New search for: Park, G. S.
    New search for: Yu, J. H.
    New search for: Seo, S. W.
    New search for: Choi, W. B.
    New search for: Paek, K. K.
    New search for: Sung, M. Y.
    New search for: Park, H. W.
    New search for: Yun, S. K.
    New search for: Ju, B. K.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

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    Wafer Level Hermetic Packaging for RF-MEMS Devices Using Electroplated Gold Layers

    New search for: Park, G. S.
    New search for: Yu, J. H.
    New search for: Seo, S. W.
    New search for: Choi, W. B.
    New search for: Paek, K. K.
    New search for: Sung, M. Y.
    New search for: Park, H. W.
    New search for: Yun, S. K.
    New search for: Ju, B. K.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wafer Level Hermetic Packaging for RF-MEMS Devices Using Electroplated Gold Layers

    New search for: Park, G. S.
    New search for: Yu, J. H.
    New search for: Seo, S. W.
    New search for: Choi, W. B.
    New search for: Paek, K. K.
    New search for: Sung, M. Y.
    New search for: Park, H. W.
    New search for: Yun, S. K.
    New search for: Ju, B. K.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Wafer Level Hermetic Packaging for RF-MEMS Devices Using Electroplated Gold Layers

    Contributors:

    Park, G. S. (author) / Yu, J. H. (author) / Seo, S. W. (author) / Choi, W. B. (author) / Paek, K. K. (author) / Sung, M. Y. (author) / Park, H. W. (author) / Yun, S. K. (author) / Ju, B. K. (author) / Lee, S.-B.

    Published in:

    Experimental Mechanics in Nano and Biotechnology ; 617-620

    KEY ENGINEERING MATERIALS ; 326/328

    Publication date:

    2006-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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