A platform for research: civil engineering, architecture and urbanism
Analytical modeling of reservoir effect on electromigration in Cu interconnects
Analytical modeling of reservoir effect on electromigration in Cu interconnects
Analytical modeling of reservoir effect on electromigration in Cu interconnects
Gan, Z. (author) / Gusak, A. M. (author) / Shao, W. (author) / Chen, Z. (author) / Mhaisalkar, S. G. (author) / Zaporozhets, T. (author) / Tu, K. N. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 152-156
2007-01-01
5 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electromigration in ULSI interconnects
British Library Online Contents | 2007
|Electromigration and IC Interconnects
British Library Online Contents | 1993
|British Library Online Contents | 2004
|Growth of electromigration-induced hillocks in Al interconnects
British Library Online Contents | 2002
|Damage mechanics of electromigration in microelectronics copper interconnects
British Library Online Contents | 2007
|