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    Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

    New search for: Nishikawa, Hiroshi
    New search for: Iwata, Noriya

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    Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

    New search for: Nishikawa, Hiroshi
    New search for: Iwata, Noriya

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

    New search for: Nishikawa, Hiroshi
    New search for: Iwata, Noriya

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

    Contributors:

    Nishikawa, Hiroshi (author) / Iwata, Noriya (author)

    Published in:

    Materials transactions ; 56 ; 1025-1029

    Publication date:

    2015-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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