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Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C
Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C
Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C
MATERIALS SCIENCE AND ENGINEERING A ; 651 ; 626-635
2016-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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