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    Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C

    New search for: Liu, Wensheng
    New search for: Wang, Yikai
    New search for: Ma, Yunzhu
    New search for: Yu, Qiang
    New search for: Huang, Yufeng

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    Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C

    New search for: Liu, Wensheng
    New search for: Wang, Yikai
    New search for: Ma, Yunzhu
    New search for: Yu, Qiang
    New search for: Huang, Yufeng

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C

    New search for: Liu, Wensheng
    New search for: Wang, Yikai
    New search for: Ma, Yunzhu
    New search for: Yu, Qiang
    New search for: Huang, Yufeng

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250°C

    Contributors:

    Liu, Wensheng (author) / Wang, Yikai (author) / Ma, Yunzhu (author) / Yu, Qiang (author) / Huang, Yufeng (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 651 ; 626-635

    Publication date:

    2016-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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