Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package: Fid-Bau Portal

Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Shohji, I. / Yoshizawa, K. / Nishimoto, M. / Kawano, T.

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Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Shohji, I. / Yoshizawa, K. / Nishimoto, M. / Kawano, T.

Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Shohji, I. / Yoshizawa, K. / Nishimoto, M. / Kawano, T.

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Order at Subito €

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Document information

Title:

Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Contributors:

Shohji, I. (author) / Yoshizawa, K. (author) / Nishimoto, M. (author) / Kawano, T. (author) / Zhou, Y. / Tu, S.-T. / Xie, X.

Published in:

Progresses in Fracture and Strength of Materials and Structures: Part 3: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2029-2032

KEY ENGINEERING MATERIALS ; 353/358

Publication date:

2007-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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